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Transistor 2SD1350, 2SD1350A Silicon NPN triple diffusion planer type For high breakdown voltage switching s Features q q q q q Unit: mm 2.40.2 2.00.2 3.50.1 High collector to base voltage VCBO. High collector to emitter voltage VCEO. Large collector power dissipation PC. Low collector to emitter saturation voltage VCE(sat). M type package allowing easy automatic and manual insertion as well as stand-alone fixing to the printed circuit board. (Ta=25C) Ratings 400 600 400 500 5 1 500 1 150 -55 ~ +150 1cm2 Unit 6.90.1 1.5 0.4 2.50.1 1.0 1.0 1.5 R0.9 R0.9 1.00.1 0.85 Parameter Collector to base voltage Collector to 2SD1350 2SD1350A 2SD1350 Symbol VCBO VCEO VEBO ICP IC PC* Tj Tstg 0.550.1 0.450.05 1.250.05 V 3 2 1 emitter voltage 2SD1350A Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature * V V A mA W C C 1:Base 2:Collector 3:Emitter 2.5 2.5 EIAJ:SC-71 M Type Mold Package Printed circuit board: Copper foil area of thickness of 1.7mm for the collector portion or more, and the board s Electrical Characteristics Parameter Collector to base voltage Collector to emitter voltage 2SD1350 2SD1350A 2SD1350 2SD1350A (Ta=25C) Symbol VCBO VCEO VEBO hFE VCE(sat) VBE(sat) fT Cob ton tf tstg Conditions IC = 100A, IE = 0 IC = 500A, IB = 0 IE = 100A, IC = 0 VCE = 5V, IC = 30mA IC = 250mA, IB = 50mA* IC = 250mA, IB = 50mA* VCB = 30V, IE = -20mA, f = 200MHz VCB = 30V, IE = 0, f = 1MHz VCC = 200V, IC = 100mA IB1 = 10mA, IB2 = -10mA VCC = 200V, IC = 100mA IB1 = 10mA, IB2 = -10mA VCC = 200V, IC = 100mA IB1 = 10mA, IB2 = -10mA 0.4 1.0 0.7 1.0 3.6 4.0 * min 400 600 400 500 5 30 typ max 4.10.2 s Absolute Maximum Ratings R 0. 4.50.1 7 Unit V V V Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance Turn-on time 2SD1350 2SD1350A 2SD1350 2SD1350A 2SD1350 2SD1350A 1.5 1.5 55 7 V V MHz pF s s s Fall time Storage time Pulse measurement 1 Transistor PC -- Ta 1.6 120 Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. Ta=25C 100 2SD1350, 2SD1350A IC -- VCE Collector to emitter saturation voltage VCE(sat) (V) 100 30 10 3 1 0.3 0.1 0.03 0.01 1 3 10 30 100 300 1000 Ta=75C 25C -25C VCE(sat) -- IC IC/IB=5 Collector power dissipation PC (W) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 Collector current IC (mA) 80 IB=1.0mA 60 0.9mA 0.8mA 0.7mA 0.6mA 0.5mA 0.4mA 0.3mA 0.2mA 0.1mA 0 2 4 6 8 10 12 40 20 0 40 60 80 100 120 140 160 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) Collector current IC (mA) VBE(sat) -- IC 100 hFE -- IC IC/IB=5 120 VCE=5V 60 fT -- I E VCB=30V Ta=25C Base to emitter saturation voltage VBE(sat) (V) 100 Transition frequency fT (MHz) 100 300 1000 30 10 3 25C 1 0.3 0.1 0.03 0.01 1 3 10 30 100 300 1000 Ta=-25C 75C Forward current transfer ratio hFE 50 80 40 60 Ta=75C 25C 30 40 -25C 20 20 10 0 1 3 10 30 0 - 0.001 - 0.003 - 0.01 - 0.03 - 0.1 - 0.3 -1 Collector current IC (mA) Collector current IC (mA) Emitter current IE (A) Cob -- VCB 30 Collector output capacitance Cob (pF) 25 IE=0 f=1MHz Ta=25C 20 15 10 5 0 10 30 100 300 1000 Collector to base voltage VCB (V) 2 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR |
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